| SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores |
Highlights: Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced IC Package. The main beneficiaries today are the fast-growing AI and data center sectors but soon after, we see glass cores expanding into any high-speed computing application, for example automotive applications. |
globenewswire.com |
2024-05-28 13:35:00 |
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